| Titre : |
Compatibility and testing of electronic components |
| Type de document : |
texte imprimé |
| Auteurs : |
C. E. [Charles Eric] Jowett |
| Editeur : |
Londres - Royaume-Uni : Butterworths |
| Année de publication : |
1972 |
| Importance : |
345 p. |
| Présentation : |
ill. |
| Format : |
23 cm |
| ISBN/ISSN/EAN : |
978-0-408-70353-6 |
| Langues : |
Anglais (eng) |
| Catégories : |
Circuits intégrés -- Essais
|
| Index. décimale : |
621.381 73 |
| Résumé : |
Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for el. |
| Note de contenu : |
Front Cover; Compatibility and Testing of Electronic Components; Copyright Page; Preface; Table of Contents; Chapter 1. Introduction; CHOICE INFLUENCED BY PROPERTIES; COMBINATION OF PROPERTIES; INTERCONNECTION OF MINIATUREPASSIVE COMPONENTS; MICROCERAMICS; SUBSTRATES; PACKAGES; Chapter 2. Integrated Circuit Compatibility; MAKING CONTACT; PROCESSING THE MATERIAL; EPITAXIAL GROWTH; DIFFUSION; PHOTOLITHOGRAPHY; CAPACITORS; INDUCTORS; TRANSISTORS; THE FET AND THE MOSFET; DIODES; ISOLATION; CIRCUIT DESIGN; TOLERANCE; YIELD; HEAT DISSIPATION; CROSSOVERS; SIMULATING PARASITICS COMPUTER ANALYSIS DESIGNSIMULATION; TOLERANCE ANALYSIS; DESTRUCTIVE TESTS; TRANSIENT ANALYSIS; Chapter 3. Survey of Semiconductor JoiningTechniques; IMPORTANCE OF TERMINOLOGY; SURVEY; CHIP JJOINING PROCESS CONSIDERATIONS; STANDOFFS; OTHER FLIP CHIP SCHEMES; BACK JOINED CONFIGURATIONS; Chapter 4. Commercial Application of Thick Film Hybrids; SYSTEMS; SYSTEMS SOLDER HYBRID APPROACH; SYSTEM PARTIONING; ENVIRONMENTAL PROTECTION; SIZEREDUCTION; COMPONENTS COMPATIBLE WITH THICK FILM HYBRIDS; CAPACITORS; CERAMIC CAPACITORS; HIGH VOLTAGE; .ULTIPLE UNITS; OTHER CERAMIC MATERIALS; NON MULTILAYER TANTALUM CAPACITORSINDUCTORS AND TRANSFORMERS; OTHER PASSIVE COMPONENTS; PHILOSOPHY OF ATTACHED COMPONENTS; USE OF CAPACITORS; THE USE OF RESISTORS IN THICKFIM HYBRIDS; INTERNAL THERMAL RESISTANCE; ASSEMBLED COMPONENT GEOMETRY; CERAMIC --
TO --
CERAMIC BONDS; SELECTION PARAMETERS FORB ONDING ALLOY; STRESS CONSIDERATIONS; METALLURGICAL COMPATIBILITY; BONDING TIME AND TEMPERATURE CONSIDERATIONS; JOINING METHOD (DEVIETO PACKAGE); SUBSTRATE FACTORS; MODULE INTERCONNECTIONS; ENCAPSULATION AND FINAL PACKAGING; EXTERNAL THERMAL RESISTANCE THERMAL ANALYSIS OF DATA DISPLAY HIGH POWER MODULES USINGR, and R, ^CONCLUSIONS; Chapter 5. Thin Film Hybrid Approach toIntegrated Circuits; MOLECULAR CIRCUITS; HYBRID CIRCUITS; Chapter 6. Factors affecting thick film devices; THICK FILM RESISTORS; THICK FILM CONDUCTORS; THICK FILM INSULATORS; DRY TRANSFER TAPES; THICK FILM PRINTING PROCESSES; CERAMIC DUAL --
IN --
LINE PACKAGE; METALLISED LEAD --
THROUGH FLATPACKS; MULTILAYER PACKAGES; MONOLITHIC CAPACITORS; BASIC TECHNOLOGY; RESISTIVE FILM; GLAZE FILM; TERMINATION; DESIGN CONSIDERATIONS; STANDARD PRODUCTS; CLOSE TOLERANCES; PERFORMANCE APPLICATIONSINDUSTRIAL APPLICATIONS; POTENTIOMETERS; CONSTRUCTION OF CERMET POTENTIOMETERS; COMPARISON OF WIREWOUND AND CERMETTYPES; MINIATURISATION OF CAPACITORS; Chapter 7. Adhesion of platinum-goldglaze conductors; PROCESS AND PROPERTIES; COMPOSITION AND STRUCTURE; ADHESION; RELIABILITY; Chapter 8. Thin inlays for electronicapplications; BACKGROUND; PREPARATION; METALLURGICAL TESTS; ELECTRICAL TESTS; Chapter 9. Humidity corrosion of metall icresistors; MOISTURETESTS; BEHAVIOUR UNDER VARIOUS LOADS; Chapter 10. The interface between glaze resistors; OBSERVATIONS; DISCUSSION AND CONCLUSIONS |
Compatibility and testing of electronic components [texte imprimé] / C. E. [Charles Eric] Jowett . - Londres - Royaume-Uni (Londres - Royaume-Uni) : Butterworths, 1972 . - 345 p. : ill. ; 23 cm. ISBN : 978-0-408-70353-6 Langues : Anglais ( eng)
| Catégories : |
Circuits intégrés -- Essais
|
| Index. décimale : |
621.381 73 |
| Résumé : |
Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for el. |
| Note de contenu : |
Front Cover; Compatibility and Testing of Electronic Components; Copyright Page; Preface; Table of Contents; Chapter 1. Introduction; CHOICE INFLUENCED BY PROPERTIES; COMBINATION OF PROPERTIES; INTERCONNECTION OF MINIATUREPASSIVE COMPONENTS; MICROCERAMICS; SUBSTRATES; PACKAGES; Chapter 2. Integrated Circuit Compatibility; MAKING CONTACT; PROCESSING THE MATERIAL; EPITAXIAL GROWTH; DIFFUSION; PHOTOLITHOGRAPHY; CAPACITORS; INDUCTORS; TRANSISTORS; THE FET AND THE MOSFET; DIODES; ISOLATION; CIRCUIT DESIGN; TOLERANCE; YIELD; HEAT DISSIPATION; CROSSOVERS; SIMULATING PARASITICS COMPUTER ANALYSIS DESIGNSIMULATION; TOLERANCE ANALYSIS; DESTRUCTIVE TESTS; TRANSIENT ANALYSIS; Chapter 3. Survey of Semiconductor JoiningTechniques; IMPORTANCE OF TERMINOLOGY; SURVEY; CHIP JJOINING PROCESS CONSIDERATIONS; STANDOFFS; OTHER FLIP CHIP SCHEMES; BACK JOINED CONFIGURATIONS; Chapter 4. Commercial Application of Thick Film Hybrids; SYSTEMS; SYSTEMS SOLDER HYBRID APPROACH; SYSTEM PARTIONING; ENVIRONMENTAL PROTECTION; SIZEREDUCTION; COMPONENTS COMPATIBLE WITH THICK FILM HYBRIDS; CAPACITORS; CERAMIC CAPACITORS; HIGH VOLTAGE; .ULTIPLE UNITS; OTHER CERAMIC MATERIALS; NON MULTILAYER TANTALUM CAPACITORSINDUCTORS AND TRANSFORMERS; OTHER PASSIVE COMPONENTS; PHILOSOPHY OF ATTACHED COMPONENTS; USE OF CAPACITORS; THE USE OF RESISTORS IN THICKFIM HYBRIDS; INTERNAL THERMAL RESISTANCE; ASSEMBLED COMPONENT GEOMETRY; CERAMIC --
TO --
CERAMIC BONDS; SELECTION PARAMETERS FORB ONDING ALLOY; STRESS CONSIDERATIONS; METALLURGICAL COMPATIBILITY; BONDING TIME AND TEMPERATURE CONSIDERATIONS; JOINING METHOD (DEVIETO PACKAGE); SUBSTRATE FACTORS; MODULE INTERCONNECTIONS; ENCAPSULATION AND FINAL PACKAGING; EXTERNAL THERMAL RESISTANCE THERMAL ANALYSIS OF DATA DISPLAY HIGH POWER MODULES USINGR, and R, ^CONCLUSIONS; Chapter 5. Thin Film Hybrid Approach toIntegrated Circuits; MOLECULAR CIRCUITS; HYBRID CIRCUITS; Chapter 6. Factors affecting thick film devices; THICK FILM RESISTORS; THICK FILM CONDUCTORS; THICK FILM INSULATORS; DRY TRANSFER TAPES; THICK FILM PRINTING PROCESSES; CERAMIC DUAL --
IN --
LINE PACKAGE; METALLISED LEAD --
THROUGH FLATPACKS; MULTILAYER PACKAGES; MONOLITHIC CAPACITORS; BASIC TECHNOLOGY; RESISTIVE FILM; GLAZE FILM; TERMINATION; DESIGN CONSIDERATIONS; STANDARD PRODUCTS; CLOSE TOLERANCES; PERFORMANCE APPLICATIONSINDUSTRIAL APPLICATIONS; POTENTIOMETERS; CONSTRUCTION OF CERMET POTENTIOMETERS; COMPARISON OF WIREWOUND AND CERMETTYPES; MINIATURISATION OF CAPACITORS; Chapter 7. Adhesion of platinum-goldglaze conductors; PROCESS AND PROPERTIES; COMPOSITION AND STRUCTURE; ADHESION; RELIABILITY; Chapter 8. Thin inlays for electronicapplications; BACKGROUND; PREPARATION; METALLURGICAL TESTS; ELECTRICAL TESTS; Chapter 9. Humidity corrosion of metall icresistors; MOISTURETESTS; BEHAVIOUR UNDER VARIOUS LOADS; Chapter 10. The interface between glaze resistors; OBSERVATIONS; DISCUSSION AND CONCLUSIONS |
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